Pure Copper Powder

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Pure Copper Powder

Product Pure Copper Powder
CAS No. 7429-50-8
Appearance Red-Brown Powder
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1-5 µM, 10-53 µM  (Can be customized),  Ask for other available size range.
Ingredient Cu
Density 63.55g/cm3
Molecular Weight 8.94g/mol
Product Codes NCZ-DCY-251/25

Pure Copper Description:

Pure Copper Powder is one of the numerous advanced ceramic materials manufactured by Nanochemazone. Nanochemazone produces too many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available. Additional technical, research and safety (MSDS) information are available. Please request a quote above for more information on lead time and pricing

Pure Copper Powder Related Information :

Storage Conditions:

Airtight sealed, avoid light and keep dry at room temperature.

Please contact us for customization and price inquiry

Email: contact@nanochemazone.com

Note: We supply different size ranges of Nano and micron as per the client’s requirements and also accept customization in various parameters.

Pure Copper Powder

Pure copper powder contains 99.5% or higher copper content. It provides excellent thermal and electrical conductivity combined with good corrosion resistance, solderability, and bio-compatibility.

Overview of Pure Copper Powder

Pure copper powder contains 99.5% or higher copper content. It provides excellent thermal and electrical conductivity combined with good corrosion resistance, solderability, and bio-compatibility.

Key properties and advantages of pure copper powder:

Pure Copper Powder Properties and Characteristics

Properties Details
Composition 99.5% or higher copper content
Density 8.94 g/cc
Particle shape Spherical, irregular
Size range 1-150 microns
Apparent density Up to 50% of true density
Conductivity Excellent, second only to silver
Solderability Excellent due to oxidation resistance
Bio-compatibility High, safe for food contact

Pure copper powder is ideal for applications like welding products, brazing alloys, friction materials, diamond tools, electrical contacts, and metal injection molding.

Pure Copper Powder Composition

Typical composition of pure copper powder:

Pure Copper Powder Composition

Element Weight %
Copper (Cu) 99.5% min
Oxygen (O) 0.05% max
Lead (Pb) 0.005% max
Other impurities 0.005% max

Copper provides excellent conductivity and corrosion resistance

Oxygen present as impurity affects conductivity and sintering

Lead and other impurities carefully controlled

Pure Copper Powder Physical Properties

Property Values
Density 8.94 g/cc
Melting point 1083°C
Thermal conductivity 400 W/mK
Electrical resistivity 1.72 μΩ-cm
Recrystallization temperature 200-300°C
Curie temperature -269°C

High density compared to magnesium or aluminum

Excellent thermal conductivity for heat dissipation

Low electrical resistivity provides high conductivity

Recrystallization enables sintering and improves ductility

Resistivity increases above Curie point

These properties make pure copper suitable for highly conductive components like electrical contacts and brushes.

Pure Copper Powder Mechanical Properties

Property Values
Tensile strength 220-340 MPa
Yield strength 69-172 MPa
Elongation 35-60%
Hardness 45-90 HB
Modulus of elasticity 110-130 GPa
Compressive strength 500-700 MPa

Good combination of strength and very high ductility

Relatively low hardness and high malleability

Moderate strength compared to high strength alloys

Properties depend on factors like porosity and grain size

The properties make pure copper suitable for soft, highly conductive components requiring good deformation and compressive strength.

Pure Copper Powder Applications

Industry Uses
Electricals Contacts, brushes, welding electrodes
Electronics Conductive adhesives, RF shielding
Automotive Brushes, bushings, bearings
Industrial Diamond tools, casting molds
Manufacturing Brazing alloys, powder metallurgy
Friction products Brake pads, clutch discs

Some specific product uses:

Sliding electrical contacts and brushes

Heat sinks and thermal management components

Welding rods, brazing pastes, and solder filler metal

Metal matrix composites like diamond tools

Net shape components made via metal injection molding

Pump bushings, impellers, and other wear parts

The high conductivity, corrosion resistance, bio-compatibility and moderate strength make pure copper suitable for this diverse range of electrical, thermal, and moderate wear applications across all industries.

Pure Copper Powder Specifications

Standard Description
ASTM B602 Specification for high purity electrolytic copper powder
JIS H2111 Specs for electrolytic copper and copper alloy powders
ISO 3497 Specification for general purpose copper powders
ASTM B243 Guidance on apparent density and flow rate

These define:

Minimum 99.5% copper content

Limits on impurities like oxygen and lead

Required powder characteristics

Apparent density and flow rate

Approved production method – electrolytic

Sampling and testing protocols

Meeting these specifications ensures suitability for applications needing high thermal and electrical conductivity combined with good mechanical properties.

Pure Copper Powder Particle Sizes

Size Characteristics
1-10 microns Ultrafine grade used in microelectronics
10-30 microns Fine grade suitable for sintering
30-150 microns Coarse grade has good flow for pressing

Finer sizes provide higher sintered density

Coarser powder has improved flowability

Size range tailored based on targeted application

Both spherical and irregular shapes available

Controlling particle size distribution optimizes pressing behavior, sintered density and final part properties.

Pure Copper Powder Apparent Density

Apparent Density Details
Up to 50% of true density For irregular powder morphology
3.5-5.0 g/cc typical Improves with greater packing density

Higher apparent density improves powder flow and compressibility

Irregular morphology limits maximum packing density

Values up to 60% achievable with spherical powder

High apparent density enables easier compaction

Higher apparent density leads to more efficient powder pressing and sintering to full density.

Pure Copper Powder Production

Method Details
Electrolysis Copper cathodes dissolved anodically into Cu+ ions and deposited on stainless steel cathodes
Ball milling Coarse powder broken down and classified into specific sizes
Annealing Softens the powder particles and improves compressibility
Reducing atmosphere Prevents oxidation of particles during production

Automated electrolytic process allows large scale production

Milling and sieving provides controlled particle size distribution

Annealing facilitates pressing and handling

Strict process control ensures high purity and repeatable quality

Pure Copper Powder Handling and Storage

Recommendation Reason
Ensure proper ventilation Prevent exposure to fine particles
Use appropriate PPE Avoid accidental ingestion
Follow safe protocols Reduce health hazards
Avoid ignition sources Flammable dust hazard
Ground equipment Prevent static discharge
Use non-sparking tools Prevent possibility of ignition

Storage Recommendations

Store in stable containers in a cool, dry area

Limit exposure to acids, ammonia, acetylene

Maintain temperatures below 30°C

Proper precautions during handling and storage help preserve purity and prevent safety issues.

Pure Copper Powder Inspection and Testing

Pure Copper Powder Testing

Test Details
Chemical analysis ICP or XRF verifies composition
Particle size distribution Laser diffraction analysis
Apparent density Hall flowmeter test per ASTM B212
Powder morphology SEM imaging of particle shape
Tap density test Density measured after mechanical tapping
Flow rate analysis Gravity flow through a specified funnel

Testing ensures the powder meets the required purity levels, particle characteristics, density specifications, morphology and flowability as per applicable standards.

Pure Copper Powder Pros and Cons

Advantages of Pure Copper Powder

Excellent thermal and electrical conductivity

Good corrosion resistance and bio-compatibility

High purity provides optimal performance

Easy to sinter and compress into high density components

Ductile and malleable

Recyclable and environmentally sustainable

Limitations of Pure Copper Powder

Lower strength than many alloy powders

Moderate high temperature oxidation resistance

Heavy compared to magnesium or aluminum

Not suitable for high wear or load bearing applications

Sensitive to contamination from zinc and sulfur

Gradually tarnishes over time if uncoated

Comparison With Brass and Bronze Powders

Pure Copper vs. Brass and Bronze Powders

Parameter Pure Copper Brass/Bronze
Density 8.94 g/cc 8.7-8.8 g/cc
Strength 220-340 MPa 350-550 MPa
Conductivity Excellent Good
Corrosion resistance Excellent Good
Cost Low Moderate
Uses Electrical, thermal Hardware, decorative

Pure copper has higher conductivity and ductility

Brass/bronze offer higher strength

Pure copper better suited for thermal management

Brass/bronze used for hardware and decorative items

Pure Copper Powder FAQs

Q: What are the main applications of pure copper powder?

A: Main applications include electrical contacts and brushes, welding rods, brazing alloys, diamond tools, heat sinks, net shape components made via powder metallurgy, friction materials, and conductive adhesives.

Q: What precautions should be taken when working with pure copper powder?

A: Recommended precautions include proper ventilation, appropriate PPE, safe handling protocols, grounding equipment, avoiding ignition sources, using non-sparking tools, and storing in stable inert containers away from contaminants.

Q: How does pure copper powder differ from electrolytic tough pitch (ETP) copper?

A: Pure copper powder has 99.5% or higher copper content, while ETP copper powder has minimum 99.5% copper. Pure copper provides slightly higher conductivity but the two are mostly interchangeable for common applications.

Q: What affects the properties of parts made from pure copper powder?

A: Key factors are apparent density, powder composition, particle size distribution, compaction pressure, sintering parameters, presence of impurities, and final part porosity.

Description

Description
Note: For pricing & ordering information, please get in touch with us at sales@nanochemazone.com
Please contact us for quotes on Larger Quantities and customization. E-mail: contact@nanochemazone.com

Customization:
If you are planning to order large quantities for your industrial and academic needs, please note that customization of parameters (such as size, length, purity, functionalities, etc.) is available upon request.

NOTE:
Images, pictures, colors, particle sizes, purity, packing, descriptions, and specifications for the real and actual goods may differ. These are only used on the website for the purposes of reference, advertising, and portrayal. Please contact us via email at sales@nanochemazone.com or by phone at (+1 780 612 4177) if you have any questions.

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