Copper-Base Solder Powder

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Copper-Base Solder Powder

Product Copper-Base Solder Powder
CAS No. 7440-50-8
Appearance Reddish-Brown Powder
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1-5 µM, 10-53 µM  (Can be customized),  Ask for other available size range.
Ingredient Sn-Ag-Cu
Density 8.96g/cm3
Molecular Weight 63.55g/mol
Product Codes NCZ-DCY-216/25

Copper-Base Solder Description:

Copper-Base Solder Powder is one of the numerous advanced ceramic materials manufactured by Nanochemazone. Nanochemazone produces too many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available. Additional technical, research and safety (MSDS) information are available. Please request a quote above for more information on lead time and pricing

Copper-Base Solder Powder Related Information :

Storage Conditions:

Airtight sealed, avoid light and keep dry at room temperature.

Please contact us for customization and price inquiry

Email: contact@nanochemazone.com

Note: We supply different size ranges of Nano and micron as per the client’s requirements and also accept customization in various parameters.

Copper-base Solder

Copper solder paste is prepared by a special process from copper-based brazing powder, trace active components, solvents, polymer carriers and other additives.

Product description

Copper solder paste is prepared by a special process from copper-based brazing powder, trace active components, solvents, polymer carriers and other additives.

Grades and specifications

Model Product Type Composition(wt%) Powder Size(M) Brazing temperature(℃) Brazing method
YTCu-1 Paste Cu:93:P:7 -200
-235
743-840 Furance, flame, resistance,
High frequency brazing
YTCu-2 Paste Cu:92.5;P:7.5 -200
-235
730-830
YTCu-3 Paste Cu:86;P:7;Sn:7 -200
-235
700-750
YTCu-4 Paste Cu:75;Sn;P;Ni, etc. -200
-235
600-650
9414 Powder Cu:88;Ni:5;Sn:7 -200
-235
890-900
  1. Suitable for flame welding, resistance welding, high frequency welding and furnace welding between various copper and copper alloys.
  2. Solder paste can be applied manually to the area to be soldered, and can also be used for semi-automatic and automatic template printing and needle injection. It is efficient and simple, and can quantitatively control the amount of solder paste used, which greatly improves work efficiency and product yield, and also improves working environment.
  3. Copper-phosphorus-based solder paste is widely used in the brazing and manufacturing of copper products such as copper tubes, copper alloy electric heating tubes, hardware parts, and various copper radiators. In the field of resistance brazing, it is widely used in resistance brazing of various electronic components, such as circuit breakers, electric meters and other components.
Description

Description
Note: For pricing & ordering information, please get in touch with us at sales@nanochemazone.com
Please contact us for quotes on Larger Quantities and customization. E-mail: contact@nanochemazone.com

Customization:
If you are planning to order large quantities for your industrial and academic needs, please note that customization of parameters (such as size, length, purity, functionalities, etc.) is available upon request.

NOTE:
Images, pictures, colors, particle sizes, purity, packing, descriptions, and specifications for the real and actual goods may differ. These are only used on the website for the purposes of reference, advertising, and portrayal. Please contact us via email at sales@nanochemazone.com or by phone at (+1 780 612 4177) if you have any questions.

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